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Rigid
There is a high demand for products using the Multilayer PCB. Product functionality depends on the interconnection between the layers that it is made up of. Without microvia production improvements, manufacturers are forced to increase product size to improve performance. The increasing cost of property is driving all industries to seek smaller products, lowering the demand for end products that contain thick, high-layer count printed circuit boards.
Flexible
The introduction and growth of the flexible printed circuit with several layers has increased the ability of manufacturers of complex electronics products to reduce end product size. Several layer flexible printed circuits combine the advantages of high-density rigid printed circuit boards with the physical attributes of Flexible PCBs. They are gaining in popularity, although they have not yet reached the performance of the Rigid Multilayer PCB alternatives. As flexible layers increase, the Flexible option loses much of its flexibility, and thus, much of their advantage over rigid boards. Although used in different applications due to different performance or physical requirements, rigid and flexible printed circuits have much in common. Many of the advantages of high-layer count printed circuit boards hold true for their flexible counterparts that have several layers. Some shared advantages include high reliability, uniform and accurate wiring, and excellent compatibility with automated machines for easy wiring, component attachment and soldering.
Our Technical specifications for Multilayer PCB’s are as follows :-
| Capability | Standard |
| Board types | Multilayer up to 24 Layers |
| Board Profiling | CNC Rout CNC Score Pierce Blank & Return |
| Minimum PWB trace width | 4 thou |
| Minimum Track Width to feature spacing | 4 thou |
| Smallest drilled hole | 0.3mm |
| Material Thickness | 0.35mm-6.4mm |
| Copper Thickness | Up to 6 oz Cu |
| Max board size | 500 mm x 400mm |
| Standard Surface finish | Hot Air Solder Level |
| Alternative finishes | Electroless Nickel / Immersion Gold Silver Electroless Tin Lead Organic ( OSP ) Hard Gold ( edge contact ) Carbon Peelable |
| Bare Board Test | Bed of Nails Simultaneous double-sided flying probe test |
| Solder mask | Photoimageable Resist with a wide range of colours. |
| Gold plate | Edge connectors Touch Pads |
